| Copper Layers |
0-30
|
| Laminates |
FR4 (130-185C Tg), polyimide, teflon, metal-core, metal-backed (more on request)
|
| Finished Thickness |
0.003" - 0.275" |
| Minimum PCB size |
0.200" x 0.200"
|
Maximum PCB size
|
50" x 59"
|
| Copper weight | 1/8 oz - 12 oz |
| Minimum trace/space | 0.003"
|
Artwork registration
|
+/- 0.003" standard, tighter control available |
Drilled hole size
| 0.006" - 0.250"
|
Hole location tolerance
| +/- 0.003" standard, tighter control available |
Hole size tolerance
| +/- 0.003" standard, tighter control available |
Hole aspect ratio
| 10:1 |
Milled hole size
| Unlimited max size, any shape |
Milled slots
| .020" min. width |
LPISM Soldermask
| Green, blue, red, white, black, yellow, clear, custom mix (gray, purple, etc.) |
Peelable Soldermask
| Available |
Silkscreen
| White, black, yellow, red |
Final finishes
| HASL, Pb-free HASL, immersion tin/silver/gold, bondable gold, hard gold, OSP, carbon ink |
Machining
| Countersink, counterbore, controlled-depth milling, edge bevel |
Panelization method
| V-score, break-tabs or both |
Inspect / Test
| AOI, CMM, X-ray, microsection, flying probe and fixtured electrical testers |
Packaging
| As requested (singulated, panel form, slip sheets, dessicant, vacuum packed, etc.) |
Special / Misc
| Controlled impedance, polymer thick film (PTF) resistors/shielding, PSA tape application, selective-area plating (different copper wieghts on same layer), plasma and more. |
