CRIMP CIRCUITS
Proudly announces the
installation of
PLASMA TREATMENT SYSTEM
 

We at Crimp Circuits Inc. continuously investing to improve our manufacturing capabilities. Following are our process and manufacturing capabilities:

 
 

Board Attributes

Value

Max Layer Count

22 Layers

Material Thickness

0.008” to 0.187”

Max. Finished Cu Thickness (O/L)

10 oz

Max. Finished Cu Thickness (I/L)

4 oz

Maximum Panel Size

20”x24”

Min Finished Hole Size

.008"

Min Trace Width/Space(mils)

.003"

Min Pad Size for test

.005"

Controlled Impedance Tolerance

10%

Solder Mask Registration

.002"

Routed Part Size Tolerance

.010"

Thickness Tolerance

10%

Buried and Burried Vias

Yes

SURFACE FINISHES CAPABILTIES

HASL (Vertical or Horizontal)

Electroless Tin

Lead Free HASL

Electrolytic Soft Gold

Immersion Silver

Electrolytic Hard Gold

Immersion Tin

Selective Gold

O.S.P.

Carbon Ink

SOLDER MASK

Semi - Gloss Green

Red

Gloss Green

Blue

Matte - Green

Clear

Black

Yellow

White

Grey

FABRICATION CAPABILITIES

Routed Array

Countersink

V Score

Different Copper Thickness on same side

Jumt Score

Counterbore

LAMINATES/MATERIALS

Arlon 85NT

Rogers R5880 /R5870/R04350B

Isola FR406 /FR408/IS410/IS620

Rogers R6010/R6002/TMM-10

Isola P95/P96

Rogers Flex 3850

Matsushita R1766/ R1755

Arlon 880/25FR/25N

Matsushita Megtron

Pyralux LF9131R

Nelco N4000-6 FC

Taconics TLY-5/TLY-3/TSM-30

Nelco N4000-29

Rogers 3000/R4003

No Flow Pre Preg

Polyclad PCL370HR/Getek

 
COPYRIGHT©2007. Crimp Circuits Incorporated. All rights reserved.